Dr. Peng Zhao received his PhD from Nanyang Technological University, in collaboration with the Institute of Microelectronics (IME), A*STAR, Singapore, in 2022. He was working on the 3D integration technologies for ion trap quantum computing devices. From 2023 to 2026, he was a Senior R&D Engineer at imec, Belgium, where he led the development of Backside Power Delivery Network (BSPDN) technologies for advanced logic nodes. He is currently an Assistant Professor at Peking University, where his research focuses on advanced 3D integration technologies for next-generation semiconductor devices. Dr. Zhao has published more than 20 technical papers, including IEDM, VLSI, ECTC, IEEE TED and TCPMT. He was the recipient of the IEEE Electronic Packaging Society Ph.D. Fellowship (2022) and was recognized as one of SEMICON Europe "20 Under 30" (2025). He also serves as a Technical Committee Member of EPTC.
